Handbook Of Plasma Processing Technology

HANDBOOK OF PLASMA PROCESSING TECHNOLOGY\nFundamentals, Etching, Deposition, and Surface Interactions\nEdited by\nStephen M. Rossnagel\nIBM Thomas J. Watson Research Center\nYorktown Heights, New York\nJerome J. Cuomo\nIBM Thomas J. Watson Research Center\nYorktown Heights, New York\nWilliam D. Westwood\nBell-Northern Research\nOttawa, Canada\nnp\nNOYES PUBLICATIONS\nPark Ridge, New Jersey, U.S.A. Copyright © 1990 by Noyes Publications\nNo part of this book may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying, recording or by any information storage and retrieval system, without permission in writing from the Publisher.\nLibrary of Congress Catalog Card Number: 89-22834\nISBN: 0-8155-1220-1\nPrinted in the United States\nPublished in the United States of America by Noyes Publications\nMill Road, Park Ridge, New Jersey 07656\n10 9 8 7 6 MATERIALS SCIENCE AND PROCESS TECHNOLOGY SERIES\nEditors\nRointan F. Bunshah, University of California, Los Angeles (Materials Science and Technology)\nGary E. McGuire, Microelectronics Center of North Carolina (Electronic Materials and Processing)\nDEPOSITION TECHNOLOGIES FOR FILMS AND COATINGS: by Rointan F. Bunshah et al\nCHEMICAL VAPOR DEPOSITION IN MICROELECTRONICS: by Arthur Sherman\nHANDBOOK OF MATERIALS AND PROCESS TECHNOLOGY HANDBOOK: edited by Gary E. McGuire\nSOL-GEL TECHNOLOGY FOR THIN FILMS, FIBERS, PREFORMS, ELECTRON-ICS AND SPECIALTY SHAPES: edited by Lisa A. Klein\nHYBRID MICROCIRCUIT TECHNOLOGY HANDBOOK: by James J. Licari and Leonard R. Einiow\nHANDBOOK OF THIN FILM DEPOSITION PROCESSES AND TECHNIQUES: edited by Klaus K. Schurgraf\nIONIZED-CLUSTER BEAM DEPOSITION AND EPITAXY: by Toshinori Takagi\nDIFFUSION PHENOMENA IN THIN FILMS AND MICROELECTRONIC MATERIALS: edited by Devendra Gupta and Paul S. Ho\nSHOCK WAVES FOR INDUSTRIAL APPLICATIONS: edited by Lawrence E. Murr\nHANDBOOK OF CONTAMINATION CONTROL IN MICROELECTRONICS: edited by Donald L. Tofler\nHANDBOOK OF ION BEAM PROCESSING TECHNOLOGY: edited by Jerome J. Cuomo, Stephen M. Rossnagel, and Harold R. Kaufman\nFRICTION AND WEAR TRANSITIONS OF MATERIALS: by Peter J. Blau\nCHARACTERIZATION OF SEMICONDUCTOR MATERIALS—Volume 1: edited by Gary E. McGuire\nSPECIAL MELTING AND PROCESSING TECHNOLOGIES: edited by G.K. Bhat\nHANDBOOK OF PLASMA PROCESSING TECHNOLOGY: edited by Stephen M. Rossnagel, Jerome J. Cuomo, and William D. Westwood\nRelated Titles\nADHESIVES TECHNOLOGY HANDBOOK: by Arthur H. Landrock\nHANDBOOK OF THERMOSET PLASTICS: edited by Sidney H. Goodman\nSURFACE PREPARATION TECHNIQUES FOR ADHESIVE BONDING: by Raymond F. Wegman This book is dedicated to the memory of Professor John Thornton of the University of Illinois, and formerly of Tellic Corporation. John was a pioneer, an innovator, and a tireless teacher in the fields of sputtering and thin film technology. He was a colleague and friend of each of the editors and the majority of contributing authors to this book. His intelligence, integrity, and dedication have touched many of us. The field of plasma-based thin film processing has grown rapidly over the past two decades. The technologies discussed in this book are the basis for the revolutionary increase in computer capabilities, as well as for such applications as tool coatings, food packaging and architectural coatings on skyscraper windows.\n\nPlasma processing technology has a number of manifestations, from simple dc discharges up to the complicated electron cyclotron resonance (ECR) plasmas intended for single wafer processing. Films are deposited and etched by a range of devices, including rf diodes, magnetrons, broad beam ion sources, hollow cathode sources and more. Each of these techniques can operate in primarily non-chemical modes with inert gases, or can easily be switched to reactive modes, where a surface can be chemically eroded or a specific chemical compound deposited. A number of hybrid techniques have emerged, such as ion impinging, ion cluster beam and activated, reactive evaporation deposition techniques.\n\nIn addition to simply the plasma process, a wealth of knowledge has been generated on ion-surface interactions. The impact of ions at many times the thermal energy of the surface can strongly change the structure as well as the chemistry of the surface. Techniques such as these allow one to explore materials not available in bulk form, and to produce new compounds, phases or structures.\n\nMuch remains to be accomplished in terms of plasma-based processing technologies. The fundamental understanding of the plasma itself is still at a crude level; the most sophisticated models are making progress in understanding the operation of simple rf diode plasmas. Classical plasma physics, as it applies to, perhaps, high temperature fusion plasmas, is beginning to make some sense of processing plasmas. However, the application of magnetic fields and the practical situation of using reactive, molecular species in the plasmas dramatically complicates the level of understanding. This book is intended to provide a perspective look at a range of thin film plasma processing technologies. The authors were selected to represent the state-of-the-art understanding. The chapters are not just the classical review type chapter found in many texts, but provide a more concise view of the level of understanding of the field today, without wading through the entire history of each field.\n\nYorktown Heights, NY\nOctober, 1989\nStephen M. Rossnagel About the Editors\n\nStephen M. Rossnagel is presently a research staff member at the IBM T.J. Watson Research Center, Yorktown Heights, New York. His current research is in plasma-based processing, particularly in ion beam and magnetron areas. He received his doctorate in physics from Colorado State University, and has held positions at Princeton University and at the Max Planck Institute in Garching, West Germany. Dr. Rossnagel has published extensively in areas of magnetron sputtering and also film modification by ion bombardment. He has published over 58 research papers and book chapters, and co-edited two books. He is the author of 6 patents, and is chairman of the Plasma Science Technology Division of the American Vacuum Society.\n\nJerome J. Cuomo is presently Manager of the Materials Processing Laboratory at the IBM T.J. Watson Research Center, Yorktown Heights, New York. Dr. Cuomo received his Ph.D. at Odense University and is particularly involved in the study of materials and the processing of materials by sputtering, ion beam and plasma processes. He has made important contributions to the development of LaB6 electron emitters and Si3N4 as dielectric layers, and also pioneered work in chemical vapor deposition, dendritic solar thermal absorbers, sputtered amorphous silicon, amorphous magnetic bubble domain materials, ion beam modification and synthesis of materials, enhanced plasma processes, and high Tc superconductors. Dr. Cuomo has been active in various capacities in the American Vacuum Society and the Materials Research Society. He is a member of the Advisory Committee to the Materials Science Department of North Carolina State University and Pennsylvania State University and is an Adjunct Professor at Cornell University. He is the author or co-author of 56 patents, 197 patent publications and 85 research papers, chapters in several books and is co-editor of two books. He is distinguished by having the highest patent level in the IBM Corporation. About the Editors\n\nWilliam D. Westwood is presently Manager of Advanced Materials and Devices at Bell-Northern Research's Advanced Technology Laboratory, Ottawa, Canada. He received his Ph.D. from the University of Aberdeen, Scotland in solid state physics. He then joined Northern Electric R&D Laboratory to work on magnetic oxide ceramics, and developed sputtering methods for fabricating thin films of these oxides. His research interests have centered on this technique since then. From 1966 to 1968, he was a faculty member at Flinders University in Australia. In 1969, he headed a group at Bell-Northern Research studying thin films for hybrid circuits, and from the sputtering aspects of this work evolved research on integrated optics. He has also been involved in technology research for electronic office applications, such as facsimile and displays. Since 1982, he has been involved in III-V semiconductor device technology for high speed electronics and optoelectronics. He has co-authored over 100 technical papers, co-edited a book, and has more than 20 patents. He has served the American Vacuum Society as a director, and is presently the Clerk of the society. Contributors\n\nJes Asmussen\nMichigan State University\nEast Lansing, MI\n\nSoren Berg\nUniversity of Uppsala\nUppsala, Sweden\n\nRointan F. Bunshah\nUniversity of California, Los Angeles\nLos Angeles, CA\n\nJoseph L. Cecchi\nPrinceton University\nPrinceton, NJ\n\nChandra V. Deshpandey\nUniversity of California, Los Angeles\nLos Angeles, CA\n\nDavid B. Fraser\nIntel Corporation\nSanta Clara, CA\n\nDavid W. Hoffman\nFord Research Center\nDearborn, MI\n\nChris M. Horwitz\nUniversity of New South Wales\nKensington, Australia\n\nHarold R. Kaufman\nFront Range Research\nFort Collins, CO\n\nRoger Kelly\nIBM, Thomas J. Watson Research Center\nYorktown Heights, NY\n\nJoseph S. Logan\nIBM, Thomas J. Watson Research Center\nYorktown Heights, NY\n\nGerald Lucovsky\nNorth Carolina State University\nRaleigh, NC\n\nRobert J. Markunas\nResearch Triangle Institute\nResearch Triangle Park, NC Donald M. Mattox\nSandia National Laboratories\nAlbuquerque, NM\n\nRobert C. McCune\nFord Research Center\nDearborn, MI\n\nJames J. McNally\nU.S. Air Force Academy\nU.S. Air Force Academy, CO\n\nRussell Messier\nPennsylvania State University\nUniversity Park, PA\n\nClaes Nender\nUniversity of Uppsala\nUppsala, Sweden\n\nGottlieb S. Oehrlein\nIBM, Thomas J. Watson Research Center\nYorktown Heights, NY\n\nLawrence J. Pilione\nPennsylvania State University\nUniversity Park, PA\n\nRafael Reif\nMassachusetts Institute of Technology\nCambridge, MA\n\nRaymond S. Robinson\nColorado State University\nFort Collins, CO\n\nStephen M. Rossnagel\nIBM, Thomas J. Watson Research Center\nYorktown Heights, NY\n\nDavid N. Ruzic\nUniversity of Illinois\nUrbana, IL\n\nDavid Sanders\nLawrence Livermore National Laboratory\nLivermore, CA\n\nDavid V. Tsu\nNorth Carolina State University\nRaleigh, NC\n\nWilliam D. Westwood\nBell-Northern Research\nOttawa, Canada\n\nIsao Yamada\nKyoto University\nSakyo, Kyoto, Japan\n\nJoseph E. Yehoda\nPennsylvania State University\nUniversity Park, PA\n\nNOTICE\n\nTo the best of the Publisher's knowledge the information contained in this book is accurate; however, the Publisher assumes no responsibility nor liability for errors or any consequences arising from the use of the information contained herein. Final determination of the suitability of any information, procedure, or product for use contemplated by any user, and the manner of that use, is the sole responsibility of the user. The book is intended for informational purposes only. Expert advice should be obtained at all times before implementation of any procedure described or implied in the book, and caution should be exercised in the use of any materials or procedures for plasma processing which could be potentially hazardous.