Data Sheet for CD4511B Types from Harris Semiconductor

Data sheet acquired from Harris Semiconductor SCHS072B Revised July 2003 Lamp Test LT Blanking BL and Latch Enable or Strobe inputs are provided to test the display shut off or intensitymodulate it and store or strobe a BCD code respectively Several different signals may be multiplexed and displayed when external multiplexing circuitry is used The CD4511B types are supplied in 16lead hermetic dualinline ceramic packages F3A suffix 16lead dualinline plastic packages E suffix 16lead smalloutline packages NSR suffix and 16lead thin shrink smalloutline packages PW and PWR suffixes These devices are similar to the type MC14511 Copyright 2003 Texas Instruments Incorporated STATIC ELECTRICAL CHARACTERISTICS TEST CONDITIONS LIMITS AT INDICATED TEMPERATURES C CHARACTERISTIC Ioh mA Vo V Vin V Vodp 55 40 85 125 Min Typ Max Units Quiescent Device Current Ipd Max 5 5 150 150 004 5 10 10 30 300 300 004 10 15 20 20 600 600 004 20 20 100 100 3000 3000 008 100 Output Voltage Low Level VOL Max 05 5 005 0 005 01 010 15 005 0 005 V HighLevel VOH Min 05 5 4 4 42 42 41 455 010 10 92 92 91 955 V 015 15 14 142 142 141 1455 Input Low Voltage VIL 053 5 15 15 188 10 3 3 613 15 4 4 Input High Voltage VIH 058 5 35 35 35 18 10 7 7 188 15 11 Output Drive Voltage High Level VOH Min 0 0 40 40 420 420 410 455 5 5 380 380 390 390 380 410 10 15 350 350 390 390 395 25 5 340 340 340 340 310 355 0 0 90 90 920 920 910 955 5 10 885 885 900 900 915 15 10 15 1390 1390 140 140 140 140 Output Low Sink Current IOL Min 04 05 5 064 061 042 036 051 1 mA 05 010 10 15 15 11 09 13 26 15 015 15 42 42 24 28 24 68 Input Current IIN Max 018 018 18 101 101 1 1 10 101 µA DYNAMIC ELECTRICAL CHARACTERISTICS at TA 25C Input ty tr 20 ns CL 50 pF RL 200 kΩ Test LIMITS All Packages UNITS VDD Volts Min Typ Max Propagation Delay Time Data 5 520 1040 ns 10 210 420 ns 15 150 300 ns HightoLow Level tPHL 5 660 1320 ns 10 260 520 ns 15 180 350 ns Propagation Delay Time BL 5 350 700 ns 10 175 350 ns 15 125 250 ns HightoLow Level tPHL 5 400 800 ns 10 175 350 ns 15 150 300 ns Propagation Delay Time 5 250 500 ns LT 10 125 250 ns 15 85 170 ns HightoLow Level tPHL 5 150 300 ns 10 75 150 ns 15 40 80 ns Transition Time 5 40 80 ns 10 30 60 ns 15 25 60 ns LowtoHigh Level tLH 5 125 310 ns 10 75 185 ns 15 65 160 ns Minimum SetUp Time tS 5 150 75 ns 10 70 35 ns 15 40 20 ns Minimum Hold Time tH 5 0 75 ns 10 0 35 ns 15 0 20 ns Strobe Pulse Width tW 5 400 200 ns 10 160 80 ns 15 100 50 ns Input Capacitance CIN 5 75 pF CD4511B Types Fig 8 Logic diagram Fig 9 Quiescent device current Fig 10 Input voltage Fig 11 Input current Fig 12 Data propagation delay Fig 13 Dynamic power dissipation Fig 14 Dynamic waveform Truth Table LE CE D A B C 0 0 0 0 1 1 0 1 0 0 1 1 0 1 0 1 0 1 0 1 0 0 1 0 1 0 1 0 1 0 1 0 0 0 1 1 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Blank Display X Dont Care Depends on BCD code previously applied when LE 0 Note Display is blank for all illegal input codes BCD 1001 CD4511B Types APPLICATIONS Interfacing with Various Displays VSS VDD LATCH DECODER V0 V0 VJ TO V0 V L E CD4511 Theory Fig 15 Driving commoncathode 7segment LED displays example HewlettPackard 50827740 Duty Cycle 100 ISEG IDIODEVG 20 mA at Luminous IntensitySegment 250 microcandles R VOH VDF ISEG Fig 18 Multiplexing with commoncathode 7segment LED displays example HewlettPackard 50827404 4 character display or 4 discrete Monosanto Man 3 displays 3259 PACKAGE OPTION ADDENDUM wwwticom 14Oct2022 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Qty Eco Plan 2 Lead finish Ball material 6 MSL Peak Temp 3 Op Temp C Device Marking 45 Samples CD4511BE ACTIVE PDIP N 16 25 RoHS Green NIPDAU N A for Pkg Type 55 to 125 CD4511BE Samples CD4511BEE4 ACTIVE PDIP N 16 25 RoHS Green NIPDAU N A for Pkg Type 55 to 125 CD4511BE Samples CD4511BF ACTIVE CDIP J 16 1 NonRoHS Green SNPB N A for Pkg Type 55 to 125 CD4511BF Samples CD4511BF3A ACTIVE CDIP J 16 1 NonRoHS Green SNPB N A for Pkg Type 55 to 125 CD4511BF3A Samples CD4511BNSR ACTIVE SO NS 16 2000 RoHS Green NIPDAU Level1260CUNLIM 55 to 125 CD4511B Samples CD4511BNSRG4 ACTIVE SO NS 16 2000 RoHS Green NIPDAU Level1260CUNLIM 55 to 125 CD4511B Samples CD4511BPW ACTIVE TSSOP PW 16 90 RoHS Green NIPDAU Level1260CUNLIM 55 to 125 CM511B Samples CD4511BPWR ACTIVE TSSOP PW 16 2000 RoHS Green NIPDAU Level1260CUNLIM 55 to 125 CM511B Samples 1 The marketing status values are defined as follows ACTIVE Product device recommended for new designs LIFEBUY TI has announced that the device will be discontinued and a lifetimebuy period is in effect NRND Not recommended for new designs Device is in production to support existing customers but TI does not recommend using this part in a new design PREVIEW Device has been announced but is not in production Samples may or may not be available OBSOLETE TI has discontinued the production of the device 2 RoHS TI defines RoHS to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances including the requirement that RoHS substance do not exceed 01 by weight in homogeneous materials Where designed to be soldered at high temperatures RoHS products are suitable for use in specified leadfree processes TI may reference these types of products as PbFree RoHS Exempt TI defines RoHS Exempt to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption Green TI defines Green to mean the content of Chlorine Cl and Bromine Br based flame retardants meet JS709B low halogen requirements of 1000ppm threshold Antimony trioxide based flame retardants must also meet the 1000ppm threshold requirement 3 MSL Peak Temp The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications and peak solder temperature 4 There may be additional marking which relates to the logo the lot trace code information or the environmental category on the device 5 Multiple Device Markings will be inside parentheses Only one Device Marking contained in parentheses and separated by a will appear on a device If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device AddendumPage 1 PACKAGE OPTION ADDENDUM wwwticom 14Oct2022 6 Lead finishBall material Orderable Devices may have multiple material finish options Finish options are separated by a vertical ruled line Lead finishBall material values may wrap to two lines if the finish value exceeds the maximum column width Important Information and DisclaimerThe information provided on this page represents TIs knowledge and belief as of the date that it is provided TI bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information Efforts are underway to better integrate information from third parties TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals TI and TI suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release In no event shall TIs liability arising out of such information exceed the total purchase price of the TI parts at issue in this document sold by TI to Customer on an annual basis OTHER QUALIFIED VERSIONS OF CD4511B CD4511BMIL Catalog CD4511B Military CD4511BMIL NOTE Qualified Version Definitions Catalog TIs standard catalog product Military QML certified for Military and Defense Applications AddendumPage 2 PACKAGE MATERIALS INFORMATION wwwticom 9Aug2022 TAPE AND REEL INFORMATION Reel Width W1 REEL DIMENSIONS A0 B0 K0 W Dimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centers Dimension designed to accommodate the component width TAPE DIMENSIONS K0 P1 B0 W A0 Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket Quadrants Sprocket Holes Q1 Q1 Q2 Q2 Q3 Q3 Q4 Q4 User Direction of Feed P1 Reel Diameter All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter mm Reel Width W1 mm A0 mm B0 mm K0 mm P1 mm W mm Pin1 Quadrant CD4511BNSR SO NS 16 2000 3300 164 82 105 25 120 160 Q1 CD4511BPWR TSSOP PW 16 2000 3300 124 69 56 16 80 120 Q1 Pack MaterialsPage 1 PACKAGE MATERIALS INFORMATION wwwticom 9Aug2022 TAPE AND REEL BOX DIMENSIONS Width mm W L H All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length mm Width mm Height mm CD4511BNSR SO NS 16 2000 3670 3670 380 CD4511BPWR TSSOP PW 16 2000 3560 3560 350 Pack MaterialsPage 2 PACKAGE MATERIALS INFORMATION wwwticom 9Aug2022 TUBE L Tube length T Tube height W Tube width B Alignment groove width All dimensions are nominal Device Package Name Package Type Pins SPQ L mm W mm T µm B mm CD4511BE N PDIP 16 25 506 1397 11230 432 CD4511BE N PDIP 16 25 506 1397 11230 432 CD4511BEE4 N PDIP 16 25 506 1397 11230 432 CD4511BEE4 N PDIP 16 25 506 1397 11230 432 CD4511BPW PW TSSOP 16 90 530 102 3600 35 Pack MaterialsPage 3 wwwticom PACKAGE OUTLINE C 82 74 TYP 14X 127 16X 051 035 2X 889 015 TYP 0 10 03 01 200 MAX 125 025 GAGE PLANE 105 055 A 104 100 NOTE 3 B 54 52 NOTE 4 4220735A 122021 SOP 200 mm max height NS0016A SOP NOTES 1 All linear dimensions are in millimeters Dimensions in parenthesis are for reference only Dimensioning and tolerancing per ASME Y145M 2 This drawing is subject to change without notice 3 This dimension does not include mold flash protrusions or gate burrs Mold flash protrusions or gate burrs shall not exceed 015 mm per side 4 This dimension does not include interlead flash Interlead flash shall not exceed 025 mm per side 1 16 025 C A B 9 8 PIN 1 ID AREA SEATING PLANE 01 C SEE DETAIL A DETAIL A TYPICAL SCALE 1500 wwwticom EXAMPLE BOARD LAYOUT 007 MAX ALL AROUND 007 MIN ALL AROUND 14X 127 R005 TYP 7 16X 185 16X 06 4220735A 122021 SOP 200 mm max height NS0016A SOP NOTES continued 5 Publication IPC7351 may have alternate designs 6 Solder mask tolerances between and around signal pads can vary based on board fabrication site METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS OPENING SOLDER MASK METAL SOLDER MASK DEFINED LAND PATTERN EXAMPLE SCALE7X SYMM 1 8 9 16 SEE DETAILS SYMM wwwticom EXAMPLE STENCIL DESIGN 7 R005 TYP 16X 185 16X 06 14X 127 4220735A 122021 SOP 200 mm max height NS0016A SOP NOTES continued 7 Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release IPC7525 may have alternate design recommendations 8 Board assembly site may have different recommendations for stencil design SOLDER PASTE EXAMPLE BASED ON 0125 mm THICK STENCIL SCALE7X SYMM SYMM 1 8 9 16 wwwticom PACKAGE OUTLINE C 14X 065 2X 455 16X 030 019 66 TYP 62 12 MAX 015 005 025 GAGE PLANE 8 0 B NOTE 4 45 43 A NOTE 3 51 49 075 050 015 TYP TSSOP 12 mm max height PW0016A SMALL OUTLINE PACKAGE 4220204A 022017 1 8 9 16 01 C A B PIN 1 INDEX AREA SEE DETAIL A 01 C NOTES 1 All linear dimensions are in millimeters Any dimensions in parenthesis are for reference only Dimensioning and tolerancing per ASME Y145M 2 This drawing is subject to change without notice 3 This dimension does not include mold flash protrusions or gate burrs Mold flash protrusions or gate burrs shall not exceed 015 mm per side 4 This dimension does not include interlead flash Interlead flash shall not exceed 025 mm per side 5 Reference JEDEC registration MO153 SEATING PLANE A 20 DETAIL A TYPICAL SCALE 2500 wwwticom EXAMPLE BOARD LAYOUT 005 MAX ALL AROUND 005 MIN ALL AROUND 16X 15 16X 045 14X 065 58 R005 TYP TSSOP 12 mm max height PW0016A SMALL OUTLINE PACKAGE 4220204A 022017 NOTES continued 6 Publication IPC7351 may have alternate designs 7 Solder mask tolerances between and around signal pads can vary based on board fabrication site LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE 10X SYMM SYMM 1 8 9 16 15000 METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METAL EXPOSED METAL SOLDER MASK DETAILS NONSOLDER MASK DEFINED PREFERRED SOLDER MASK DEFINED wwwticom EXAMPLE STENCIL DESIGN 16X 15 16X 045 14X 065 58 R005 TYP TSSOP 12 mm max height PW0016A SMALL OUTLINE PACKAGE 4220204A 022017 NOTES continued 8 Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release IPC7525 may have alternate design recommendations 9 Board assembly site may have different recommendations for stencil design SOLDER PASTE EXAMPLE BASED ON 0125 mm THICK STENCIL SCALE 10X SYMM SYMM 1 8 9 16 MECHANICAL DATA NS RPD SOQ 14PINS SHOWN PLASTIC SMALLOUTLINE PACKAGE DIM A MAX A MIN 1050 990 10250 DIM 127 051 035 560 500 015 005 NOTES A All linear dimensions are in millimeters B This drawing is subject to change without notice C Body dimensions do not include mold flash or protrusion not to exceed 015 TEXAS INSTRUMENTS wwwticom J RGDIPT CERAMIC DUAL INLINE PACKAGE 14 LEADS SHOWN DIM A B MAX 0300 B MIN C MAX 0300 C MIN 0005 013 MIN 0060 152 MAX NOTES A All linear dimensions are in inches millimeters B This drawing is subject to change without notice C This package is hermetically sealed with a ceramic lid using glass frit 4040083F 0303 N RPDIPT PLASTIC DUALINLINE PACKAGE 16 PINS SHOWN DIM A MAX 178 0045 114 0070 178 0030 076 0020 MIN 0200 MAX A MIN 1969 0775 1965 0775 2692 1060 0940 2159 0850 660 0260 610 0240 0325 826 0300 051 0125 318 0100 254 0021 053 0015 038 0010 025 1418 Pin Only 20 Pin vendor option 4040049E 122002 wwwticom IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA INCLUDING DATA SHEETS DESIGN RESOURCES INCLUDING REFERENCE DESIGNS APPLICATION OR OTHER DESIGN ADVICE WEB TOOLS SAFETY INFORMATION AND OTHER RESOURCES AS IS AND WITH ALL FAULTS AND DISCLAIMS ALL WARRANTIES EXPRESS AND IMPLIED 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